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Product Comparison
Part number |
Real-M300 |
Real-M200 |
On-chip SRAM |
TrustZone |
Flash |
PSRAM |
Wi-Fi |
Bluetooth |
Operating voltage |
Operating temperature |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8721DAF-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8721DAF-VT2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-40°C ~ 105°C |
QFN48 (6 x 6) |
RTL8721DAM-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8721DCF-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721DCM-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721DCM-VA3-CG |
345MHz |
115MHz |
512KB |
Y |
X |
8MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721DGF-VW2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
1.71V ~ 3.63V |
-20°C ~ 85°C |
BGA100 (5.1 x 5.1) |
RTL8721DGM-VW2-CG |
345MHz |
115MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
1.71V ~ 3.63V |
-20°C ~ 85°C |
BGA100 (5.1 x 5.1) |
Key Features
Wi-Fi 4 2.4GHz/5GHz Dual-band + Bluetooth 5.0 LE
PSA Level-2 certified
Ultra-low power
FreeRTOS/Zephyr supported
Block Diagram
Block diagram
Core Architecture
Real-M300 (KM4)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 345MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Integrated FPU/DSP extensions
Hardware-enforced isolation via TrustZone®-M
Real-M200 (KM0)
Armv8-M architecture (Arm® Cortex®-M23 ISA compatible)
Up to 115MHz, 2-stage pipeline
Code-compatible with KM4, Optimized for μA-level operation
Memory System
On-chip memory: 512KB SRAM
External memory (including KGD):
QSPI NOR Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 200MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripheral Interfaces
Flexible design of GPIO configuration
Multi-communication interfaces: SPI x 2, UART x 4, I2C x 2
Hardware Key-Scan interface supports up to 8*8 (64) keys
Hardware IR transceiver, easy to adapt to various IR protocols
Supports Real-Time Clock timer together with 10 basic timers
Supports 8 channels of PWM timer and 1 capture timer
Supports 7 channels of general 12-bit ADC and 1 channel of VBAT
Supports 4 channels of touch pad
Supports 8 independent channels of GDMA
Supports USB 2.0 full-speed device mode
Supports SDIO device with 1-bit and 4-bit mode
Embeds a serial LEDC to control the external LED lamps
Integrated Pixel Processing Engine (PPE) to process pixel data faster
Integrated OSPI display interface supports screens with OSPI/QSPI/SPI interfaces
Integrated audio codec supports 2 channels DMIC interface
I2S x 2: up to 384kHz sampling rate
Security Features
Secure boot
Arm TrustZone-M security architecture
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD password protection
2KB OTP memory (2K bits available for user)
PSA Level-2 certified
Wireless Connectivity
Wi-Fi 4 (802.11a/b/g/n)
802.11 a/b/g/n, 1T1R, 2.4GHz/5GHz dual-band
40MHz channel bandwidth, MCS0 ~ MCS7 modulation
Antenna diversity
WoWLAN power saving:
84μA@2.4GHz (DTIM=10, 3.3V, 25°C)
122μA@5GHz (DTIM=10, 3.3V, 25°C)
Bluetooth 5.0 LE
LE Coded PHY long-range mode (125kbps/500kbps)
Scatternet: 8 masters + 3 slaves
Tx Power: -10dBm ~ +10dBm (typical 8dBm)
Rx sensitivity: -99dBm@1Mbps
Power Management
Dynamic voltage/frequency scaling (1.71V ~ 3.63V)
Power modes:
Active mode: Full operation (345MHz)
Sleep mode: Peripherals or Wi-Fi can wake up the system (<100uA)
Deep-Sleep mode: 10.4µA (1.8V, 25°C)
Package and Reliability
QFN48 package: 6mm x 6mm
QFN68 package: 8mm x 8mm
BGA100 package: 5.1mm x 5.1mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Wide-range voltage: 1.71V ~ 3.63V
Operating temperature:
Standard temperature: -20°C ~ 85°C
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Smart home appliance
Line controller
Smart door lock
Battery camera
Smart remote controller
Wi-Fi speaker
WHC FullMAC NIC
BLE gateway
Smart POS
Resources
Product Comparison
Package number |
Real-M300 |
KR4 |
DSP |
On-chip SRAM |
TrustZone |
Flash |
PSRAM |
Wi-Fi |
Bluetooth |
Operating temperature |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8720EAF-VA2-CG |
400MHz |
400MHz |
X |
768KB |
Y |
4MB |
X |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8720EAF-VA3-CG |
400MHz |
400MHz |
X |
768KB |
Y |
8MB |
X |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8720EAM-VA2-CG |
400MHz |
400MHz |
X |
768KB |
Y |
X |
4MB |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8720EAM-VT2-CG |
400MHz |
400MHz |
X |
768KB |
Y |
X |
4MB |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-40°C ~ 105°C |
QFN48 (6 x 6) |
Key Features
Arm/RISC-V dual-core architecture
Wi-Fi 6 2.4GHz
Bluetooth 5.2 LE
Block Diagram
Core Architecture
Real-M300 (KM4)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 400MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Integrated FPU/DSP extensions, and M-profile Vector Extension (MVE)
Hardware-enforced isolation via TrustZone®-M
KR4
RISC-V RV32IMAFC architecture
400MHz single-issue in-order pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Open-source ISA with custom extension support
Memory System
On-chip memory: 768KB SRAM
External memory (including KGD):
QSPI NOR Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 200MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripheral Interfaces
Matrix-type pin configuration, each pin supports almost all functions
Multiple communication interfaces: SPI x 2, UART x 5, I2C x 2
Hardware IR transceiver, easy to adapt to various IR protocols
Supports RTC timer and 15 independent timers
Supports 8-channel PWM timer and 1 capture timer
Supports 6-channel general-purpose 12-bit ADC
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports 1 independent watchdog, 2 secure area watchdogs, and 3 general watchdogs
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Security
Secure boot
Arm TrustZone-M security architecture
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD port password protection/disabling
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (2.4GHz 802.11ax)
Supports 802.11b/g/n/ax protocols with 20MHz bandwidth
PHY rates:286.8Mbps (HT40), 114.7Mbps (HE20)
Antenna diversity
Bluetooth 5.2 LE
LE Coded PHY long-range mode (125kbps/500kbps)
AoA/AoD positioning (±15° accuracy)
Scatternet concurrent master/slave operation
SIG Mesh v1.0 and v1.1.1
RF Performance
Wi-Fi Tx power:
11b 11Mbps: 20dBm
11g 54Mbps: 19dBm (EVM < −25dB)
11n MCS7-HT20: 18dBm (EVM < −27dB)
11ax MCS9-HE20: 16dBm (EVM < −32dB)
Wi-Fi Rx sensitivity:
11b 11Mbps: −91dBm
11g 54Mbps: −78dBm
11n MCS7-HT20: −76.5dBm
11ax MCS9-HE20: −70.5dBm
BLE specifications:
Tx power: +10dBm (0.5dB step)
Rx sensitivity: -97dBm@1Mbps
Power Management
Dynamic voltage scaling (0.8V ~ 1.2V)
Power modes:
Active mode (Wi-Fi Tx): 120mA@3.3V
Sleep mode: Peripherals and Wi-Fi can wake up the system
Deep-Sleep mode: 15μA (RTC retention)
Package and Reliability
QFN48 package: 6mm x 6mm
QFN68 package: 8mm x 8mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Standard temperature: -20°C ~ 85°C
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Home appliance
Line controller
BLE gateway
Micro inverter
Portable energy storage
Home energy storage
Resources
Product Comparison
Package number |
Real-M300 |
KR4 |
DSP |
On-chip SRAM |
TrustZone |
Flash |
PSRAM |
Wi-Fi |
Bluetooth |
Operating temperature |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8726EAM-VA4-CG |
400MHz |
400MHz |
500MHz |
512KB |
Y |
X |
16MB |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-20°C ~ 85°C |
QFN68 (8 x 8) |
Key Features
ARM/RISC-V/Cadence® Tensilica® HiFi 5 DSP three-core architecture
Wi-Fi 6 2.4GHz
Bluetooth 5.2 LE
Applicable for compute-intensive scenarios such as speech recognition
Block Diagram
Core Architecture
Real-M300 (KM4)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 400MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Integrated FPU/DSP extensions, and M-profile Vector Extension (MVE)
Hardware-enforced isolation via TrustZone®-M
KR4
RISC-V RV32IMAFC architecture
400MHz single-issue in-order pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Open-source ISA with custom extension support
Cadence® Tensilica® HiFi 5 DSP
500MHz 5-slot VLIW architecture
8 x 32-bit MAC/cycle, Optional SP-FPU (8 SP-FMAC/cycle)
Neural Network Extension (32 x 8-bit MAC/cycle)
32KB 4-way I-Cache, 48KB 3-way D-Cache
256KB dedicated DTCM memory
Memory System
On-chip memory: 512KB SRAM
External memory (including KGD):
QSPI NOR Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 250MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripheral Interfaces
Matrix-type pin configuration, each pin supports almost all functions
Multiple communication interfaces: SPI x 2, UART x 5, I2C x 2
Hardware IR transceiver, easy to adapt to various IR protocols
Supports RTC timer and 15 independent timers
Supports 8-channel PWM timer and 1 capture timer
Supports 6-channel general-purpose 12-bit ADC
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports 1 independent watchdog, 2 secure area watchdogs, and 3 general watchdogs
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Audio system:
3-channel ADC or 4-channel digital microphone (DMIC) input
1-channel digital-to-analog converter (DAC)
Integrates 2 I2S interfaces (up to 384kHz sampling rate, supports up to 8-channel data transmission and reception)
Security
Secure boot
Arm TrustZone-M security architecture
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD port password protection/disabling
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (2.4GHz 802.11ax)
Supports 802.11b/g/n/ax protocols with 20MHz bandwidth
PHY rates:286.8Mbps (HT40), 114.7Mbps (HE20)
Antenna diversity
Bluetooth 5.2 LE
LE Coded PHY long-range mode (125kbps/500kbps)
AoA/AoD positioning (±15° accuracy)
Scatternet concurrent master/slave operation
SIG Mesh v1.0 and v1.1.1
RF Performance
Wi-Fi Tx power:
11b 11Mbps: 20dBm
11g 54Mbps: 19dBm (EVM < −25dB)
11n MCS7-HT20: 18dBm (EVM < −27dB)
11ax MCS9-HE20: 16dBm (EVM < −32dB)
Wi-Fi Rx sensitivity:
11b 11Mbps: −91dBm
11g 54Mbps: −78dBm
11n MCS7-HT20: −76.5dBm
11ax MCS9-HE20: −70.5dBm
BLE specifications:
Tx power: +10dBm (0.5dB step)
Rx sensitivity: -97dBm@1Mbps
Power Management
Dynamic voltage scaling (0.8V ~ 1.2V)
Power modes:
Active mode (Wi-Fi Tx): 120mA@3.3V
Sleep mode: Peripherals and Wi-Fi can wake up the system
Deep-Sleep mode: 15μA (RTC retention)
Package and Reliability
QFN48 package: 6mm x 6mm
QFN68 package: 8mm x 8mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Standard temperature: -20°C ~ 85°C
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Home appliance
Line controller
BLE gateway
Micro inverter
Portable energy storage
Home energy storage
Resources
Product Comparison
Package number |
CA32 |
Real-M300 |
Real-M300 |
On-chip SRAM |
TrustZone |
NOR Flash |
PSRAM |
DDR |
Wi-Fi |
Bluetooth |
GPIO |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8730EAH-VA3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
8MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAH-VD3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
16MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAH-VH6-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
32MB |
X |
64MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAM-VA6-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
64MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730ELH-VA3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
8MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
RTL8730ELM-VA7-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
128MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
RTL8730ELM-VA8-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
256MB (DDR3L) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
Key Features
Wi-Fi 6 2.4GHz/5GHz dual-band
BT dual mode (BLE 5.3 + BT Classic)
Dedicated antenna for Bluetooth
Dual-Core Arm® Cortex®-A32 & Linux/FreeRTOS supported
DDR & PSRAM supported
Low power
Block Diagram
Core Architecture
Dual-Core Arm® Cortex®-A32 (AP)
Armv8-A architecture (ISA)
Up to 1.2GHz, 8-stage in-order pipeline
32KB 2-way I-Cache + 32KB 4-way D-Cache, 256KB 8-way L2 cache
TrustZone® security for secure/non-secure domain isolation
Real-M300 (KM4, NP)
Up to 333MHz, 3-stage pipeline
16KB 4-way I-Cache + 32KB 4-way D-Cache
Cortex®-M55 ISA, FPU/DSP/MVE extensions
TrustZone®-M hardware isolation
Real-M200 (LP)
Uo to 40MHz
16KB 2-way I-Cache + 8KB 2-way D-Cache
Cortex®-M23 ISA, optimized for power-critical applications
Memory System
On-chip memory: 512KB SRAM
qExternal memory (including KGD):
QSPI NOR/NAND Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 250MHz)
DQ16 DDR2/DDR3L (up to 533MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripherals & Interfaces
Flexible design of GPIO configuration
Multi-communication interfaces: SPI x 2, UART x 4, I2C x 3
Hardware IR transceiver, easy to adapt to various IR protocols
Supports 6 channels of general 12-bit ADC and 1 channel of VBAT
Audio Codec:
5-channel ADC or 8-channel digital microphone (DMIC) input
2-channel digital-to-analog converter (DAC) and headphone amplifier
Supports 6-channel PWM timer and 1 capture timer
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports high-speed USB 2.0 OTG
Supports SD host controller to access SD card and eMMC device
Supports 1 Real-Time Clock timer together with 12 basic timers
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Supports two-lane MIPI-DSI interface with D-PHY and the maximum bit rate of 1Gbps per lane
I2S x 2: up to 384kHz sampling rate
Security
Secure boot
TrustZone®/TrustZone®-M dual-domain isolation
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA/EdDSA/RSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD interface lock
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (802.11ax) :
802.11 a/b/g/n/ax, 1T1R, 2.4GHz/5GHz dual-band
MCS0-MCS9 (20 MHz bandwidth)
Antenna diversity, Beamforming, Target Wake Time (TWT)
WoWLAN
Bluetooth 5.3:
BR/EDR + BLE
LE Coded PHY long-range mode (125kbps/500kbps)
LE Audio (CIS/BIS)
AoA/AoD positioning
SIG Mesh v1.0/v1.1
Scatternet support
Dedicated antenna for Bluetooth
Power Management
Fine-grained clock gating, dynamic voltage/frequency scaling (DVFS)
Power modes: Active/Sleep/Deep-Sleep (μA-level standby)
Package and Reliability
QFN100 package: 10mm x 10mm
DR-QFN144 package: 11mm x 11mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Smart speakers
Industrial gateways
Voice-controlled appliances
Smart Home
Wearables
Centralized control systems
Integrates Wi-Fi and Low-Power Bluetooth (BLE 5.0/5.2/5.3), features rich peripheral interfaces, achieves system-level protection through a hardware-based security architecture, and delivers optimal power consumption performance. Empowers diverse IoT application development, such as smart home and industrial automation.
Resources
Product Comparison
Package number |
Real-M300 |
KR4 |
DSP |
On-chip SRAM |
TrustZone |
Flash |
PSRAM |
Wi-Fi |
Bluetooth |
Operating temperature |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8720EAF-VA2-CG |
400MHz |
400MHz |
X |
768KB |
Y |
4MB |
X |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8720EAF-VA3-CG |
400MHz |
400MHz |
X |
768KB |
Y |
8MB |
X |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8720EAM-VA2-CG |
400MHz |
400MHz |
X |
768KB |
Y |
X |
4MB |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8720EAM-VT2-CG |
400MHz |
400MHz |
X |
768KB |
Y |
X |
4MB |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-40°C ~ 105°C |
QFN48 (6 x 6) |
Key Features
Arm/RISC-V dual-core architecture
Wi-Fi 6 2.4GHz
Bluetooth 5.2 LE
Block Diagram
Core Architecture
Real-M300 (KM4)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 400MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Integrated FPU/DSP extensions, and M-profile Vector Extension (MVE)
Hardware-enforced isolation via TrustZone®-M
KR4
RISC-V RV32IMAFC architecture
400MHz single-issue in-order pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Open-source ISA with custom extension support
Memory System
On-chip memory: 768KB SRAM
External memory (including KGD):
QSPI NOR Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 200MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripheral Interfaces
Matrix-type pin configuration, each pin supports almost all functions
Multiple communication interfaces: SPI x 2, UART x 5, I2C x 2
Hardware IR transceiver, easy to adapt to various IR protocols
Supports RTC timer and 15 independent timers
Supports 8-channel PWM timer and 1 capture timer
Supports 6-channel general-purpose 12-bit ADC
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports 1 independent watchdog, 2 secure area watchdogs, and 3 general watchdogs
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Security
Secure boot
Arm TrustZone-M security architecture
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD port password protection/disabling
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (2.4GHz 802.11ax)
Supports 802.11b/g/n/ax protocols with 20MHz bandwidth
PHY rates:286.8Mbps (HT40), 114.7Mbps (HE20)
Antenna diversity
Bluetooth 5.2 LE
LE Coded PHY long-range mode (125kbps/500kbps)
AoA/AoD positioning (±15° accuracy)
Scatternet concurrent master/slave operation
SIG Mesh v1.0 and v1.1.1
RF Performance
Wi-Fi Tx power:
11b 11Mbps: 20dBm
11g 54Mbps: 19dBm (EVM < −25dB)
11n MCS7-HT20: 18dBm (EVM < −27dB)
11ax MCS9-HE20: 16dBm (EVM < −32dB)
Wi-Fi Rx sensitivity:
11b 11Mbps: −91dBm
11g 54Mbps: −78dBm
11n MCS7-HT20: −76.5dBm
11ax MCS9-HE20: −70.5dBm
BLE specifications:
Tx power: +10dBm (0.5dB step)
Rx sensitivity: -97dBm@1Mbps
Power Management
Dynamic voltage scaling (0.8V ~ 1.2V)
Power modes:
Active mode (Wi-Fi Tx): 120mA@3.3V
Sleep mode: Peripherals and Wi-Fi can wake up the system
Deep-Sleep mode: 15μA (RTC retention)
Package and Reliability
QFN48 package: 6mm x 6mm
QFN68 package: 8mm x 8mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Standard temperature: -20°C ~ 85°C
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Home appliance
Line controller
BLE gateway
Micro inverter
Portable energy storage
Home energy storage
Resources
Product Comparison
Part number |
Real-M300 |
Real-M200 |
On-chip SRAM |
TrustZone |
Flash |
PSRAM |
Wi-Fi |
Bluetooth |
Operating voltage |
Operating temperature |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8721DAF-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8721DAF-VT2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-40°C ~ 105°C |
QFN48 (6 x 6) |
RTL8721DAM-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8721DCF-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721DCM-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721DCM-VA3-CG |
345MHz |
115MHz |
512KB |
Y |
X |
8MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721DGF-VW2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
1.71V ~ 3.63V |
-20°C ~ 85°C |
BGA100 (5.1 x 5.1) |
RTL8721DGM-VW2-CG |
345MHz |
115MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
1.71V ~ 3.63V |
-20°C ~ 85°C |
BGA100 (5.1 x 5.1) |
Key Features
Wi-Fi 4 2.4GHz/5GHz Dual-band + Bluetooth 5.0 LE
PSA Level-2 certified
Ultra-low power
FreeRTOS/Zephyr supported
Block Diagram
Block diagram
Core Architecture
Real-M300 (KM4)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 345MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Integrated FPU/DSP extensions
Hardware-enforced isolation via TrustZone®-M
Real-M200 (KM0)
Armv8-M architecture (Arm® Cortex®-M23 ISA compatible)
Up to 115MHz, 2-stage pipeline
Code-compatible with KM4, Optimized for μA-level operation
Memory System
On-chip memory: 512KB SRAM
External memory (including KGD):
QSPI NOR Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 200MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripheral Interfaces
Flexible design of GPIO configuration
Multi-communication interfaces: SPI x 2, UART x 4, I2C x 2
Hardware Key-Scan interface supports up to 8*8 (64) keys
Hardware IR transceiver, easy to adapt to various IR protocols
Supports Real-Time Clock timer together with 10 basic timers
Supports 8 channels of PWM timer and 1 capture timer
Supports 7 channels of general 12-bit ADC and 1 channel of VBAT
Supports 4 channels of touch pad
Supports 8 independent channels of GDMA
Supports USB 2.0 full-speed device mode
Supports SDIO device with 1-bit and 4-bit mode
Embeds a serial LEDC to control the external LED lamps
Integrated Pixel Processing Engine (PPE) to process pixel data faster
Integrated OSPI display interface supports screens with OSPI/QSPI/SPI interfaces
Integrated audio codec supports 2 channels DMIC interface
I2S x 2: up to 384kHz sampling rate
Security Features
Secure boot
Arm TrustZone-M security architecture
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD password protection
2KB OTP memory (2K bits available for user)
PSA Level-2 certified
Wireless Connectivity
Wi-Fi 4 (802.11a/b/g/n)
802.11 a/b/g/n, 1T1R, 2.4GHz/5GHz dual-band
40MHz channel bandwidth, MCS0 ~ MCS7 modulation
Antenna diversity
WoWLAN power saving:
84μA@2.4GHz (DTIM=10, 3.3V, 25°C)
122μA@5GHz (DTIM=10, 3.3V, 25°C)
Bluetooth 5.0 LE
LE Coded PHY long-range mode (125kbps/500kbps)
Scatternet: 8 masters + 3 slaves
Tx Power: -10dBm ~ +10dBm (typical 8dBm)
Rx sensitivity: -99dBm@1Mbps
Power Management
Dynamic voltage/frequency scaling (1.71V ~ 3.63V)
Power modes:
Active mode: Full operation (345MHz)
Sleep mode: Peripherals or Wi-Fi can wake up the system (<100uA)
Deep-Sleep mode: 10.4µA (1.8V, 25°C)
Package and Reliability
QFN48 package: 6mm x 6mm
QFN68 package: 8mm x 8mm
BGA100 package: 5.1mm x 5.1mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Wide-range voltage: 1.71V ~ 3.63V
Operating temperature:
Standard temperature: -20°C ~ 85°C
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Smart home appliance
Line controller
Smart door lock
Battery camera
Smart remote controller
Wi-Fi speaker
WHC FullMAC NIC
BLE gateway
Smart POS
Integrates Wi-Fi and Low-Power Bluetooth (BLE 5.0/5.2/5.3), features rich peripheral interfaces, achieves system-level protection through a hardware-based security architecture, and delivers the lowest power consumption performance. Includes an Audio Codec module to support voice signal acquisition and playback.
Resources
Product Comparison
Package number |
Real-M300 |
KR4 |
DSP |
On-chip SRAM |
TrustZone |
Flash |
PSRAM |
Wi-Fi |
Bluetooth |
Operating temperature |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8726EAM-VA4-CG |
400MHz |
400MHz |
500MHz |
512KB |
Y |
X |
16MB |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-20°C ~ 85°C |
QFN68 (8 x 8) |
Key Features
ARM/RISC-V/Cadence® Tensilica® HiFi 5 DSP three-core architecture
Wi-Fi 6 2.4GHz
Bluetooth 5.2 LE
Applicable for compute-intensive scenarios such as speech recognition
Block Diagram
Core Architecture
Real-M300 (KM4)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 400MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Integrated FPU/DSP extensions, and M-profile Vector Extension (MVE)
Hardware-enforced isolation via TrustZone®-M
KR4
RISC-V RV32IMAFC architecture
400MHz single-issue in-order pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Open-source ISA with custom extension support
Cadence® Tensilica® HiFi 5 DSP
500MHz 5-slot VLIW architecture
8 x 32-bit MAC/cycle, Optional SP-FPU (8 SP-FMAC/cycle)
Neural Network Extension (32 x 8-bit MAC/cycle)
32KB 4-way I-Cache, 48KB 3-way D-Cache
256KB dedicated DTCM memory
Memory System
On-chip memory: 512KB SRAM
External memory (including KGD):
QSPI NOR Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 250MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripheral Interfaces
Matrix-type pin configuration, each pin supports almost all functions
Multiple communication interfaces: SPI x 2, UART x 5, I2C x 2
Hardware IR transceiver, easy to adapt to various IR protocols
Supports RTC timer and 15 independent timers
Supports 8-channel PWM timer and 1 capture timer
Supports 6-channel general-purpose 12-bit ADC
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports 1 independent watchdog, 2 secure area watchdogs, and 3 general watchdogs
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Audio system:
3-channel ADC or 4-channel digital microphone (DMIC) input
1-channel digital-to-analog converter (DAC)
Integrates 2 I2S interfaces (up to 384kHz sampling rate, supports up to 8-channel data transmission and reception)
Security
Secure boot
Arm TrustZone-M security architecture
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD port password protection/disabling
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (2.4GHz 802.11ax)
Supports 802.11b/g/n/ax protocols with 20MHz bandwidth
PHY rates:286.8Mbps (HT40), 114.7Mbps (HE20)
Antenna diversity
Bluetooth 5.2 LE
LE Coded PHY long-range mode (125kbps/500kbps)
AoA/AoD positioning (±15° accuracy)
Scatternet concurrent master/slave operation
SIG Mesh v1.0 and v1.1.1
RF Performance
Wi-Fi Tx power:
11b 11Mbps: 20dBm
11g 54Mbps: 19dBm (EVM < −25dB)
11n MCS7-HT20: 18dBm (EVM < −27dB)
11ax MCS9-HE20: 16dBm (EVM < −32dB)
Wi-Fi Rx sensitivity:
11b 11Mbps: −91dBm
11g 54Mbps: −78dBm
11n MCS7-HT20: −76.5dBm
11ax MCS9-HE20: −70.5dBm
BLE specifications:
Tx power: +10dBm (0.5dB step)
Rx sensitivity: -97dBm@1Mbps
Power Management
Dynamic voltage scaling (0.8V ~ 1.2V)
Power modes:
Active mode (Wi-Fi Tx): 120mA@3.3V
Sleep mode: Peripherals and Wi-Fi can wake up the system
Deep-Sleep mode: 15μA (RTC retention)
Package and Reliability
QFN48 package: 6mm x 6mm
QFN68 package: 8mm x 8mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Standard temperature: -20°C ~ 85°C
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Home appliance
Line controller
BLE gateway
Micro inverter
Portable energy storage
Home energy storage
Resources
Product Comparison
Package number |
CA32 |
Real-M300 |
Real-M300 |
On-chip SRAM |
TrustZone |
NOR Flash |
PSRAM |
DDR |
Wi-Fi |
Bluetooth |
GPIO |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8730EAH-VA3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
8MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAH-VD3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
16MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAH-VH6-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
32MB |
X |
64MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAM-VA6-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
64MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730ELH-VA3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
8MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
RTL8730ELM-VA7-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
128MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
RTL8730ELM-VA8-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
256MB (DDR3L) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
Key Features
Wi-Fi 6 2.4GHz/5GHz dual-band
BT dual mode (BLE 5.3 + BT Classic)
Dedicated antenna for Bluetooth
Dual-Core Arm® Cortex®-A32 & Linux/FreeRTOS supported
DDR & PSRAM supported
Low power
Block Diagram
Core Architecture
Dual-Core Arm® Cortex®-A32 (AP)
Armv8-A architecture (ISA)
Up to 1.2GHz, 8-stage in-order pipeline
32KB 2-way I-Cache + 32KB 4-way D-Cache, 256KB 8-way L2 cache
TrustZone® security for secure/non-secure domain isolation
Real-M300 (KM4, NP)
Up to 333MHz, 3-stage pipeline
16KB 4-way I-Cache + 32KB 4-way D-Cache
Cortex®-M55 ISA, FPU/DSP/MVE extensions
TrustZone®-M hardware isolation
Real-M200 (LP)
Uo to 40MHz
16KB 2-way I-Cache + 8KB 2-way D-Cache
Cortex®-M23 ISA, optimized for power-critical applications
Memory System
On-chip memory: 512KB SRAM
qExternal memory (including KGD):
QSPI NOR/NAND Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 250MHz)
DQ16 DDR2/DDR3L (up to 533MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripherals & Interfaces
Flexible design of GPIO configuration
Multi-communication interfaces: SPI x 2, UART x 4, I2C x 3
Hardware IR transceiver, easy to adapt to various IR protocols
Supports 6 channels of general 12-bit ADC and 1 channel of VBAT
Audio Codec:
5-channel ADC or 8-channel digital microphone (DMIC) input
2-channel digital-to-analog converter (DAC) and headphone amplifier
Supports 6-channel PWM timer and 1 capture timer
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports high-speed USB 2.0 OTG
Supports SD host controller to access SD card and eMMC device
Supports 1 Real-Time Clock timer together with 12 basic timers
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Supports two-lane MIPI-DSI interface with D-PHY and the maximum bit rate of 1Gbps per lane
I2S x 2: up to 384kHz sampling rate
Security
Secure boot
TrustZone®/TrustZone®-M dual-domain isolation
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA/EdDSA/RSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD interface lock
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (802.11ax) :
802.11 a/b/g/n/ax, 1T1R, 2.4GHz/5GHz dual-band
MCS0-MCS9 (20 MHz bandwidth)
Antenna diversity, Beamforming, Target Wake Time (TWT)
WoWLAN
Bluetooth 5.3:
BR/EDR + BLE
LE Coded PHY long-range mode (125kbps/500kbps)
LE Audio (CIS/BIS)
AoA/AoD positioning
SIG Mesh v1.0/v1.1
Scatternet support
Dedicated antenna for Bluetooth
Power Management
Fine-grained clock gating, dynamic voltage/frequency scaling (DVFS)
Power modes: Active/Sleep/Deep-Sleep (μA-level standby)
Package and Reliability
QFN100 package: 10mm x 10mm
DR-QFN144 package: 11mm x 11mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Smart speakers
Industrial gateways
Voice-controlled appliances
Smart Home
Wearables
Centralized control systems
Integrates Wi-Fi and Low-Power Bluetooth (BLE 5.0/5.2/5.3), features rich peripheral interfaces, achieves system-level protection through a hardware-based security architecture, and delivers ultra-low power consumption performance. Empowers low-power IoT applications such as wearable devices and smart healthcare.
Resources
Product Comparison
Part number |
Real-M300 |
Real-M200 |
On-chip SRAM |
TrustZone |
Flash |
PSRAM |
Wi-Fi |
Bluetooth |
Operating voltage |
Operating temperature |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8721DAF-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8721DAF-VT2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-40°C ~ 105°C |
QFN48 (6 x 6) |
RTL8721DAM-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8721DCF-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721DCM-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721DCM-VA3-CG |
345MHz |
115MHz |
512KB |
Y |
X |
8MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721DGF-VW2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
1.71V ~ 3.63V |
-20°C ~ 85°C |
BGA100 (5.1 x 5.1) |
RTL8721DGM-VW2-CG |
345MHz |
115MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
1.71V ~ 3.63V |
-20°C ~ 85°C |
BGA100 (5.1 x 5.1) |
Key Features
Wi-Fi 4 2.4GHz/5GHz Dual-band + Bluetooth 5.0 LE
PSA Level-2 certified
Ultra-low power
FreeRTOS/Zephyr supported
Block Diagram
Block diagram
Core Architecture
Real-M300 (KM4)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 345MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Integrated FPU/DSP extensions
Hardware-enforced isolation via TrustZone®-M
Real-M200 (KM0)
Armv8-M architecture (Arm® Cortex®-M23 ISA compatible)
Up to 115MHz, 2-stage pipeline
Code-compatible with KM4, Optimized for μA-level operation
Memory System
On-chip memory: 512KB SRAM
External memory (including KGD):
QSPI NOR Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 200MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripheral Interfaces
Flexible design of GPIO configuration
Multi-communication interfaces: SPI x 2, UART x 4, I2C x 2
Hardware Key-Scan interface supports up to 8*8 (64) keys
Hardware IR transceiver, easy to adapt to various IR protocols
Supports Real-Time Clock timer together with 10 basic timers
Supports 8 channels of PWM timer and 1 capture timer
Supports 7 channels of general 12-bit ADC and 1 channel of VBAT
Supports 4 channels of touch pad
Supports 8 independent channels of GDMA
Supports USB 2.0 full-speed device mode
Supports SDIO device with 1-bit and 4-bit mode
Embeds a serial LEDC to control the external LED lamps
Integrated Pixel Processing Engine (PPE) to process pixel data faster
Integrated OSPI display interface supports screens with OSPI/QSPI/SPI interfaces
Integrated audio codec supports 2 channels DMIC interface
I2S x 2: up to 384kHz sampling rate
Security Features
Secure boot
Arm TrustZone-M security architecture
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD password protection
2KB OTP memory (2K bits available for user)
PSA Level-2 certified
Wireless Connectivity
Wi-Fi 4 (802.11a/b/g/n)
802.11 a/b/g/n, 1T1R, 2.4GHz/5GHz dual-band
40MHz channel bandwidth, MCS0 ~ MCS7 modulation
Antenna diversity
WoWLAN power saving:
84μA@2.4GHz (DTIM=10, 3.3V, 25°C)
122μA@5GHz (DTIM=10, 3.3V, 25°C)
Bluetooth 5.0 LE
LE Coded PHY long-range mode (125kbps/500kbps)
Scatternet: 8 masters + 3 slaves
Tx Power: -10dBm ~ +10dBm (typical 8dBm)
Rx sensitivity: -99dBm@1Mbps
Power Management
Dynamic voltage/frequency scaling (1.71V ~ 3.63V)
Power modes:
Active mode: Full operation (345MHz)
Sleep mode: Peripherals or Wi-Fi can wake up the system (<100uA)
Deep-Sleep mode: 10.4µA (1.8V, 25°C)
Package and Reliability
QFN48 package: 6mm x 6mm
QFN68 package: 8mm x 8mm
BGA100 package: 5.1mm x 5.1mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Wide-range voltage: 1.71V ~ 3.63V
Operating temperature:
Standard temperature: -20°C ~ 85°C
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Smart home appliance
Line controller
Smart door lock
Battery camera
Smart remote controller
Wi-Fi speaker
WHC FullMAC NIC
BLE gateway
Smart POS
Integrates Wi-Fi and Low-Power Bluetooth (BLE 5.0/5.2/5.3), features rich peripheral interfaces, achieves system-level protection through a hardware-based security architecture, and delivers optimal power consumption performance. The high-performance SoC integrates Arm Cortex™-A32 MPCore™ or HiFi5 DSP, precisely empowering intelligent perception layers (AI inference/image processing) and human-machine interaction layers (voice recognition/HMI). Processors based on the Armv8-A instruction set support product development using Linux or RTOS.
Resources
Product Comparison
Package number |
Real-M300 |
KR4 |
DSP |
On-chip SRAM |
TrustZone |
Flash |
PSRAM |
Wi-Fi |
Bluetooth |
Operating temperature |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8726EAM-VA4-CG |
400MHz |
400MHz |
500MHz |
512KB |
Y |
X |
16MB |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-20°C ~ 85°C |
QFN68 (8 x 8) |
Key Features
ARM/RISC-V/Cadence® Tensilica® HiFi 5 DSP three-core architecture
Wi-Fi 6 2.4GHz
Bluetooth 5.2 LE
Applicable for compute-intensive scenarios such as speech recognition
Block Diagram
Core Architecture
Real-M300 (KM4)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 400MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Integrated FPU/DSP extensions, and M-profile Vector Extension (MVE)
Hardware-enforced isolation via TrustZone®-M
KR4
RISC-V RV32IMAFC architecture
400MHz single-issue in-order pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Open-source ISA with custom extension support
Cadence® Tensilica® HiFi 5 DSP
500MHz 5-slot VLIW architecture
8 x 32-bit MAC/cycle, Optional SP-FPU (8 SP-FMAC/cycle)
Neural Network Extension (32 x 8-bit MAC/cycle)
32KB 4-way I-Cache, 48KB 3-way D-Cache
256KB dedicated DTCM memory
Memory System
On-chip memory: 512KB SRAM
External memory (including KGD):
QSPI NOR Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 250MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripheral Interfaces
Matrix-type pin configuration, each pin supports almost all functions
Multiple communication interfaces: SPI x 2, UART x 5, I2C x 2
Hardware IR transceiver, easy to adapt to various IR protocols
Supports RTC timer and 15 independent timers
Supports 8-channel PWM timer and 1 capture timer
Supports 6-channel general-purpose 12-bit ADC
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports 1 independent watchdog, 2 secure area watchdogs, and 3 general watchdogs
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Audio system:
3-channel ADC or 4-channel digital microphone (DMIC) input
1-channel digital-to-analog converter (DAC)
Integrates 2 I2S interfaces (up to 384kHz sampling rate, supports up to 8-channel data transmission and reception)
Security
Secure boot
Arm TrustZone-M security architecture
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD port password protection/disabling
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (2.4GHz 802.11ax)
Supports 802.11b/g/n/ax protocols with 20MHz bandwidth
PHY rates:286.8Mbps (HT40), 114.7Mbps (HE20)
Antenna diversity
Bluetooth 5.2 LE
LE Coded PHY long-range mode (125kbps/500kbps)
AoA/AoD positioning (±15° accuracy)
Scatternet concurrent master/slave operation
SIG Mesh v1.0 and v1.1.1
RF Performance
Wi-Fi Tx power:
11b 11Mbps: 20dBm
11g 54Mbps: 19dBm (EVM < −25dB)
11n MCS7-HT20: 18dBm (EVM < −27dB)
11ax MCS9-HE20: 16dBm (EVM < −32dB)
Wi-Fi Rx sensitivity:
11b 11Mbps: −91dBm
11g 54Mbps: −78dBm
11n MCS7-HT20: −76.5dBm
11ax MCS9-HE20: −70.5dBm
BLE specifications:
Tx power: +10dBm (0.5dB step)
Rx sensitivity: -97dBm@1Mbps
Power Management
Dynamic voltage scaling (0.8V ~ 1.2V)
Power modes:
Active mode (Wi-Fi Tx): 120mA@3.3V
Sleep mode: Peripherals and Wi-Fi can wake up the system
Deep-Sleep mode: 15μA (RTC retention)
Package and Reliability
QFN48 package: 6mm x 6mm
QFN68 package: 8mm x 8mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Standard temperature: -20°C ~ 85°C
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Home appliance
Line controller
BLE gateway
Micro inverter
Portable energy storage
Home energy storage
Resources
Product Comparison
Package number |
CA32 |
Real-M300 |
Real-M300 |
On-chip SRAM |
TrustZone |
NOR Flash |
PSRAM |
DDR |
Wi-Fi |
Bluetooth |
GPIO |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8730EAH-VA3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
8MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAH-VD3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
16MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAH-VH6-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
32MB |
X |
64MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAM-VA6-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
64MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730ELH-VA3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
8MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
RTL8730ELM-VA7-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
128MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
RTL8730ELM-VA8-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
256MB (DDR3L) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
Key Features
Wi-Fi 6 2.4GHz/5GHz dual-band
BT dual mode (BLE 5.3 + BT Classic)
Dedicated antenna for Bluetooth
Dual-Core Arm® Cortex®-A32 & Linux/FreeRTOS supported
DDR & PSRAM supported
Low power
Block Diagram
Core Architecture
Dual-Core Arm® Cortex®-A32 (AP)
Armv8-A architecture (ISA)
Up to 1.2GHz, 8-stage in-order pipeline
32KB 2-way I-Cache + 32KB 4-way D-Cache, 256KB 8-way L2 cache
TrustZone® security for secure/non-secure domain isolation
Real-M300 (KM4, NP)
Up to 333MHz, 3-stage pipeline
16KB 4-way I-Cache + 32KB 4-way D-Cache
Cortex®-M55 ISA, FPU/DSP/MVE extensions
TrustZone®-M hardware isolation
Real-M200 (LP)
Uo to 40MHz
16KB 2-way I-Cache + 8KB 2-way D-Cache
Cortex®-M23 ISA, optimized for power-critical applications
Memory System
On-chip memory: 512KB SRAM
qExternal memory (including KGD):
QSPI NOR/NAND Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 250MHz)
DQ16 DDR2/DDR3L (up to 533MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripherals & Interfaces
Flexible design of GPIO configuration
Multi-communication interfaces: SPI x 2, UART x 4, I2C x 3
Hardware IR transceiver, easy to adapt to various IR protocols
Supports 6 channels of general 12-bit ADC and 1 channel of VBAT
Audio Codec:
5-channel ADC or 8-channel digital microphone (DMIC) input
2-channel digital-to-analog converter (DAC) and headphone amplifier
Supports 6-channel PWM timer and 1 capture timer
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports high-speed USB 2.0 OTG
Supports SD host controller to access SD card and eMMC device
Supports 1 Real-Time Clock timer together with 12 basic timers
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Supports two-lane MIPI-DSI interface with D-PHY and the maximum bit rate of 1Gbps per lane
I2S x 2: up to 384kHz sampling rate
Security
Secure boot
TrustZone®/TrustZone®-M dual-domain isolation
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA/EdDSA/RSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD interface lock
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (802.11ax) :
802.11 a/b/g/n/ax, 1T1R, 2.4GHz/5GHz dual-band
MCS0-MCS9 (20 MHz bandwidth)
Antenna diversity, Beamforming, Target Wake Time (TWT)
WoWLAN
Bluetooth 5.3:
BR/EDR + BLE
LE Coded PHY long-range mode (125kbps/500kbps)
LE Audio (CIS/BIS)
AoA/AoD positioning
SIG Mesh v1.0/v1.1
Scatternet support
Dedicated antenna for Bluetooth
Power Management
Fine-grained clock gating, dynamic voltage/frequency scaling (DVFS)
Power modes: Active/Sleep/Deep-Sleep (μA-level standby)
Package and Reliability
QFN100 package: 10mm x 10mm
DR-QFN144 package: 11mm x 11mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Smart speakers
Industrial gateways
Voice-controlled appliances
Smart Home
Wearables
Centralized control systems
Integrates Wi-Fi 6 (compliant with IEEE 802.11ax standard) and Low-Power Bluetooth (BLE 5.0/5.2/5.3), features rich peripheral interfaces, achieves system-level protection through a hardware-based security architecture, and delivers optimal power consumption performance. Wi-Fi 6 integration ensures higher throughput and lower latency for users.
Resources
Product Comparison
Package number |
Real-M300 |
KR4 |
DSP |
On-chip SRAM |
TrustZone |
Flash |
PSRAM |
Wi-Fi |
Bluetooth |
Operating temperature |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8726EAM-VA4-CG |
400MHz |
400MHz |
500MHz |
512KB |
Y |
X |
16MB |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-20°C ~ 85°C |
QFN68 (8 x 8) |
Key Features
ARM/RISC-V/Cadence® Tensilica® HiFi 5 DSP three-core architecture
Wi-Fi 6 2.4GHz
Bluetooth 5.2 LE
Applicable for compute-intensive scenarios such as speech recognition
Block Diagram
Core Architecture
Real-M300 (KM4)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 400MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Integrated FPU/DSP extensions, and M-profile Vector Extension (MVE)
Hardware-enforced isolation via TrustZone®-M
KR4
RISC-V RV32IMAFC architecture
400MHz single-issue in-order pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Open-source ISA with custom extension support
Cadence® Tensilica® HiFi 5 DSP
500MHz 5-slot VLIW architecture
8 x 32-bit MAC/cycle, Optional SP-FPU (8 SP-FMAC/cycle)
Neural Network Extension (32 x 8-bit MAC/cycle)
32KB 4-way I-Cache, 48KB 3-way D-Cache
256KB dedicated DTCM memory
Memory System
On-chip memory: 512KB SRAM
External memory (including KGD):
QSPI NOR Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 250MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripheral Interfaces
Matrix-type pin configuration, each pin supports almost all functions
Multiple communication interfaces: SPI x 2, UART x 5, I2C x 2
Hardware IR transceiver, easy to adapt to various IR protocols
Supports RTC timer and 15 independent timers
Supports 8-channel PWM timer and 1 capture timer
Supports 6-channel general-purpose 12-bit ADC
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports 1 independent watchdog, 2 secure area watchdogs, and 3 general watchdogs
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Audio system:
3-channel ADC or 4-channel digital microphone (DMIC) input
1-channel digital-to-analog converter (DAC)
Integrates 2 I2S interfaces (up to 384kHz sampling rate, supports up to 8-channel data transmission and reception)
Security
Secure boot
Arm TrustZone-M security architecture
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD port password protection/disabling
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (2.4GHz 802.11ax)
Supports 802.11b/g/n/ax protocols with 20MHz bandwidth
PHY rates:286.8Mbps (HT40), 114.7Mbps (HE20)
Antenna diversity
Bluetooth 5.2 LE
LE Coded PHY long-range mode (125kbps/500kbps)
AoA/AoD positioning (±15° accuracy)
Scatternet concurrent master/slave operation
SIG Mesh v1.0 and v1.1.1
RF Performance
Wi-Fi Tx power:
11b 11Mbps: 20dBm
11g 54Mbps: 19dBm (EVM < −25dB)
11n MCS7-HT20: 18dBm (EVM < −27dB)
11ax MCS9-HE20: 16dBm (EVM < −32dB)
Wi-Fi Rx sensitivity:
11b 11Mbps: −91dBm
11g 54Mbps: −78dBm
11n MCS7-HT20: −76.5dBm
11ax MCS9-HE20: −70.5dBm
BLE specifications:
Tx power: +10dBm (0.5dB step)
Rx sensitivity: -97dBm@1Mbps
Power Management
Dynamic voltage scaling (0.8V ~ 1.2V)
Power modes:
Active mode (Wi-Fi Tx): 120mA@3.3V
Sleep mode: Peripherals and Wi-Fi can wake up the system
Deep-Sleep mode: 15μA (RTC retention)
Package and Reliability
QFN48 package: 6mm x 6mm
QFN68 package: 8mm x 8mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Standard temperature: -20°C ~ 85°C
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Home appliance
Line controller
BLE gateway
Micro inverter
Portable energy storage
Home energy storage
Resources
Product Comparison
Package number |
Real-M300 |
KR4 |
DSP |
On-chip SRAM |
TrustZone |
Flash |
PSRAM |
Wi-Fi |
Bluetooth |
Operating temperature |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8720EAF-VA2-CG |
400MHz |
400MHz |
X |
768KB |
Y |
4MB |
X |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8720EAF-VA3-CG |
400MHz |
400MHz |
X |
768KB |
Y |
8MB |
X |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8720EAM-VA2-CG |
400MHz |
400MHz |
X |
768KB |
Y |
X |
4MB |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8720EAM-VT2-CG |
400MHz |
400MHz |
X |
768KB |
Y |
X |
4MB |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-40°C ~ 105°C |
QFN48 (6 x 6) |
Key Features
Arm/RISC-V dual-core architecture
Wi-Fi 6 2.4GHz
Bluetooth 5.2 LE
Block Diagram
Core Architecture
Real-M300 (KM4)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 400MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Integrated FPU/DSP extensions, and M-profile Vector Extension (MVE)
Hardware-enforced isolation via TrustZone®-M
KR4
RISC-V RV32IMAFC architecture
400MHz single-issue in-order pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Open-source ISA with custom extension support
Memory System
On-chip memory: 768KB SRAM
External memory (including KGD):
QSPI NOR Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 200MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripheral Interfaces
Matrix-type pin configuration, each pin supports almost all functions
Multiple communication interfaces: SPI x 2, UART x 5, I2C x 2
Hardware IR transceiver, easy to adapt to various IR protocols
Supports RTC timer and 15 independent timers
Supports 8-channel PWM timer and 1 capture timer
Supports 6-channel general-purpose 12-bit ADC
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports 1 independent watchdog, 2 secure area watchdogs, and 3 general watchdogs
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Security
Secure boot
Arm TrustZone-M security architecture
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD port password protection/disabling
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (2.4GHz 802.11ax)
Supports 802.11b/g/n/ax protocols with 20MHz bandwidth
PHY rates:286.8Mbps (HT40), 114.7Mbps (HE20)
Antenna diversity
Bluetooth 5.2 LE
LE Coded PHY long-range mode (125kbps/500kbps)
AoA/AoD positioning (±15° accuracy)
Scatternet concurrent master/slave operation
SIG Mesh v1.0 and v1.1.1
RF Performance
Wi-Fi Tx power:
11b 11Mbps: 20dBm
11g 54Mbps: 19dBm (EVM < −25dB)
11n MCS7-HT20: 18dBm (EVM < −27dB)
11ax MCS9-HE20: 16dBm (EVM < −32dB)
Wi-Fi Rx sensitivity:
11b 11Mbps: −91dBm
11g 54Mbps: −78dBm
11n MCS7-HT20: −76.5dBm
11ax MCS9-HE20: −70.5dBm
BLE specifications:
Tx power: +10dBm (0.5dB step)
Rx sensitivity: -97dBm@1Mbps
Power Management
Dynamic voltage scaling (0.8V ~ 1.2V)
Power modes:
Active mode (Wi-Fi Tx): 120mA@3.3V
Sleep mode: Peripherals and Wi-Fi can wake up the system
Deep-Sleep mode: 15μA (RTC retention)
Package and Reliability
QFN48 package: 6mm x 6mm
QFN68 package: 8mm x 8mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Standard temperature: -20°C ~ 85°C
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Home appliance
Line controller
BLE gateway
Micro inverter
Portable energy storage
Home energy storage
Resources
Product Comparison
Package number |
CA32 |
Real-M300 |
Real-M300 |
On-chip SRAM |
TrustZone |
NOR Flash |
PSRAM |
DDR |
Wi-Fi |
Bluetooth |
GPIO |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8730EAH-VA3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
8MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAH-VD3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
16MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAH-VH6-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
32MB |
X |
64MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAM-VA6-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
64MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730ELH-VA3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
8MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
RTL8730ELM-VA7-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
128MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
RTL8730ELM-VA8-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
256MB (DDR3L) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
Key Features
Wi-Fi 6 2.4GHz/5GHz dual-band
BT dual mode (BLE 5.3 + BT Classic)
Dedicated antenna for Bluetooth
Dual-Core Arm® Cortex®-A32 & Linux/FreeRTOS supported
DDR & PSRAM supported
Low power
Block Diagram
Core Architecture
Dual-Core Arm® Cortex®-A32 (AP)
Armv8-A architecture (ISA)
Up to 1.2GHz, 8-stage in-order pipeline
32KB 2-way I-Cache + 32KB 4-way D-Cache, 256KB 8-way L2 cache
TrustZone® security for secure/non-secure domain isolation
Real-M300 (KM4, NP)
Up to 333MHz, 3-stage pipeline
16KB 4-way I-Cache + 32KB 4-way D-Cache
Cortex®-M55 ISA, FPU/DSP/MVE extensions
TrustZone®-M hardware isolation
Real-M200 (LP)
Uo to 40MHz
16KB 2-way I-Cache + 8KB 2-way D-Cache
Cortex®-M23 ISA, optimized for power-critical applications
Memory System
On-chip memory: 512KB SRAM
qExternal memory (including KGD):
QSPI NOR/NAND Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 250MHz)
DQ16 DDR2/DDR3L (up to 533MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripherals & Interfaces
Flexible design of GPIO configuration
Multi-communication interfaces: SPI x 2, UART x 4, I2C x 3
Hardware IR transceiver, easy to adapt to various IR protocols
Supports 6 channels of general 12-bit ADC and 1 channel of VBAT
Audio Codec:
5-channel ADC or 8-channel digital microphone (DMIC) input
2-channel digital-to-analog converter (DAC) and headphone amplifier
Supports 6-channel PWM timer and 1 capture timer
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports high-speed USB 2.0 OTG
Supports SD host controller to access SD card and eMMC device
Supports 1 Real-Time Clock timer together with 12 basic timers
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Supports two-lane MIPI-DSI interface with D-PHY and the maximum bit rate of 1Gbps per lane
I2S x 2: up to 384kHz sampling rate
Security
Secure boot
TrustZone®/TrustZone®-M dual-domain isolation
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA/EdDSA/RSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD interface lock
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (802.11ax) :
802.11 a/b/g/n/ax, 1T1R, 2.4GHz/5GHz dual-band
MCS0-MCS9 (20 MHz bandwidth)
Antenna diversity, Beamforming, Target Wake Time (TWT)
WoWLAN
Bluetooth 5.3:
BR/EDR + BLE
LE Coded PHY long-range mode (125kbps/500kbps)
LE Audio (CIS/BIS)
AoA/AoD positioning
SIG Mesh v1.0/v1.1
Scatternet support
Dedicated antenna for Bluetooth
Power Management
Fine-grained clock gating, dynamic voltage/frequency scaling (DVFS)
Power modes: Active/Sleep/Deep-Sleep (μA-level standby)
Package and Reliability
QFN100 package: 10mm x 10mm
DR-QFN144 package: 11mm x 11mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Smart speakers
Industrial gateways
Voice-controlled appliances
Smart Home
Wearables
Centralized control systems
Integrates Wi-Fi (with 5GHz band physical layer optimization) and Low-Power Bluetooth (BLE 5.0/5.2/5.3), features rich peripheral interfaces, achieves system-level protection through a hardware-based security architecture, and delivers optimal power consumption performance. Wi-Fi 5G integration ensures stable network connectivity for users.
Resources
Product Comparison
Part number |
Real-M300 |
Real-M200 |
On-chip SRAM |
TrustZone |
Flash |
PSRAM |
Wi-Fi |
Bluetooth |
Operating voltage |
Operating temperature |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8721DAF-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8721DAF-VT2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-40°C ~ 105°C |
QFN48 (6 x 6) |
RTL8721DAM-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8721DCF-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721DCM-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721DCM-VA3-CG |
345MHz |
115MHz |
512KB |
Y |
X |
8MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721DGF-VW2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
1.71V ~ 3.63V |
-20°C ~ 85°C |
BGA100 (5.1 x 5.1) |
RTL8721DGM-VW2-CG |
345MHz |
115MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
1.71V ~ 3.63V |
-20°C ~ 85°C |
BGA100 (5.1 x 5.1) |
Key Features
Wi-Fi 4 2.4GHz/5GHz Dual-band + Bluetooth 5.0 LE
PSA Level-2 certified
Ultra-low power
FreeRTOS/Zephyr supported
Block Diagram
Block diagram
Core Architecture
Real-M300 (KM4)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 345MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Integrated FPU/DSP extensions
Hardware-enforced isolation via TrustZone®-M
Real-M200 (KM0)
Armv8-M architecture (Arm® Cortex®-M23 ISA compatible)
Up to 115MHz, 2-stage pipeline
Code-compatible with KM4, Optimized for μA-level operation
Memory System
On-chip memory: 512KB SRAM
External memory (including KGD):
QSPI NOR Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 200MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripheral Interfaces
Flexible design of GPIO configuration
Multi-communication interfaces: SPI x 2, UART x 4, I2C x 2
Hardware Key-Scan interface supports up to 8*8 (64) keys
Hardware IR transceiver, easy to adapt to various IR protocols
Supports Real-Time Clock timer together with 10 basic timers
Supports 8 channels of PWM timer and 1 capture timer
Supports 7 channels of general 12-bit ADC and 1 channel of VBAT
Supports 4 channels of touch pad
Supports 8 independent channels of GDMA
Supports USB 2.0 full-speed device mode
Supports SDIO device with 1-bit and 4-bit mode
Embeds a serial LEDC to control the external LED lamps
Integrated Pixel Processing Engine (PPE) to process pixel data faster
Integrated OSPI display interface supports screens with OSPI/QSPI/SPI interfaces
Integrated audio codec supports 2 channels DMIC interface
I2S x 2: up to 384kHz sampling rate
Security Features
Secure boot
Arm TrustZone-M security architecture
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD password protection
2KB OTP memory (2K bits available for user)
PSA Level-2 certified
Wireless Connectivity
Wi-Fi 4 (802.11a/b/g/n)
802.11 a/b/g/n, 1T1R, 2.4GHz/5GHz dual-band
40MHz channel bandwidth, MCS0 ~ MCS7 modulation
Antenna diversity
WoWLAN power saving:
84μA@2.4GHz (DTIM=10, 3.3V, 25°C)
122μA@5GHz (DTIM=10, 3.3V, 25°C)
Bluetooth 5.0 LE
LE Coded PHY long-range mode (125kbps/500kbps)
Scatternet: 8 masters + 3 slaves
Tx Power: -10dBm ~ +10dBm (typical 8dBm)
Rx sensitivity: -99dBm@1Mbps
Power Management
Dynamic voltage/frequency scaling (1.71V ~ 3.63V)
Power modes:
Active mode: Full operation (345MHz)
Sleep mode: Peripherals or Wi-Fi can wake up the system (<100uA)
Deep-Sleep mode: 10.4µA (1.8V, 25°C)
Package and Reliability
QFN48 package: 6mm x 6mm
QFN68 package: 8mm x 8mm
BGA100 package: 5.1mm x 5.1mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Wide-range voltage: 1.71V ~ 3.63V
Operating temperature:
Standard temperature: -20°C ~ 85°C
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Smart home appliance
Line controller
Smart door lock
Battery camera
Smart remote controller
Wi-Fi speaker
WHC FullMAC NIC
BLE gateway
Smart POS
Resources
Product Comparison
Package number |
CA32 |
Real-M300 |
Real-M300 |
On-chip SRAM |
TrustZone |
NOR Flash |
PSRAM |
DDR |
Wi-Fi |
Bluetooth |
GPIO |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8730EAH-VA3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
8MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAH-VD3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
16MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAH-VH6-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
32MB |
X |
64MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAM-VA6-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
64MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730ELH-VA3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
8MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
RTL8730ELM-VA7-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
128MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
RTL8730ELM-VA8-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
256MB (DDR3L) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
Key Features
Wi-Fi 6 2.4GHz/5GHz dual-band
BT dual mode (BLE 5.3 + BT Classic)
Dedicated antenna for Bluetooth
Dual-Core Arm® Cortex®-A32 & Linux/FreeRTOS supported
DDR & PSRAM supported
Low power
Block Diagram
Core Architecture
Dual-Core Arm® Cortex®-A32 (AP)
Armv8-A architecture (ISA)
Up to 1.2GHz, 8-stage in-order pipeline
32KB 2-way I-Cache + 32KB 4-way D-Cache, 256KB 8-way L2 cache
TrustZone® security for secure/non-secure domain isolation
Real-M300 (KM4, NP)
Up to 333MHz, 3-stage pipeline
16KB 4-way I-Cache + 32KB 4-way D-Cache
Cortex®-M55 ISA, FPU/DSP/MVE extensions
TrustZone®-M hardware isolation
Real-M200 (LP)
Uo to 40MHz
16KB 2-way I-Cache + 8KB 2-way D-Cache
Cortex®-M23 ISA, optimized for power-critical applications
Memory System
On-chip memory: 512KB SRAM
qExternal memory (including KGD):
QSPI NOR/NAND Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 250MHz)
DQ16 DDR2/DDR3L (up to 533MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripherals & Interfaces
Flexible design of GPIO configuration
Multi-communication interfaces: SPI x 2, UART x 4, I2C x 3
Hardware IR transceiver, easy to adapt to various IR protocols
Supports 6 channels of general 12-bit ADC and 1 channel of VBAT
Audio Codec:
5-channel ADC or 8-channel digital microphone (DMIC) input
2-channel digital-to-analog converter (DAC) and headphone amplifier
Supports 6-channel PWM timer and 1 capture timer
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports high-speed USB 2.0 OTG
Supports SD host controller to access SD card and eMMC device
Supports 1 Real-Time Clock timer together with 12 basic timers
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Supports two-lane MIPI-DSI interface with D-PHY and the maximum bit rate of 1Gbps per lane
I2S x 2: up to 384kHz sampling rate
Security
Secure boot
TrustZone®/TrustZone®-M dual-domain isolation
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA/EdDSA/RSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD interface lock
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (802.11ax) :
802.11 a/b/g/n/ax, 1T1R, 2.4GHz/5GHz dual-band
MCS0-MCS9 (20 MHz bandwidth)
Antenna diversity, Beamforming, Target Wake Time (TWT)
WoWLAN
Bluetooth 5.3:
BR/EDR + BLE
LE Coded PHY long-range mode (125kbps/500kbps)
LE Audio (CIS/BIS)
AoA/AoD positioning
SIG Mesh v1.0/v1.1
Scatternet support
Dedicated antenna for Bluetooth
Power Management
Fine-grained clock gating, dynamic voltage/frequency scaling (DVFS)
Power modes: Active/Sleep/Deep-Sleep (μA-level standby)
Package and Reliability
QFN100 package: 10mm x 10mm
DR-QFN144 package: 11mm x 11mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Smart speakers
Industrial gateways
Voice-controlled appliances
Smart Home
Wearables
Centralized control systems
Integrates Wi-Fi and Low-Power Bluetooth (BLE 5.0/5.2/5.3), features rich peripheral interfaces, achieves system-level protection through a hardware-based security architecture, and delivers the lowest power consumption performance. Includes an Audio Codec module to support voice signal acquisition and playback.
Resources
Product Comparison
Part number |
Real-M300 |
Real-M200 |
On-chip SRAM |
TrustZone |
Flash |
PSRAM |
Wi-Fi |
Bluetooth |
Operating voltage |
Operating temperature |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8721DAF-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8721DAF-VT2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-40°C ~ 105°C |
QFN48 (6 x 6) |
RTL8721DAM-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8721DCF-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721DCM-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721DCM-VA3-CG |
345MHz |
115MHz |
512KB |
Y |
X |
8MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721DGF-VW2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
1.71V ~ 3.63V |
-20°C ~ 85°C |
BGA100 (5.1 x 5.1) |
RTL8721DGM-VW2-CG |
345MHz |
115MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
1.71V ~ 3.63V |
-20°C ~ 85°C |
BGA100 (5.1 x 5.1) |
Key Features
Wi-Fi 4 2.4GHz/5GHz Dual-band + Bluetooth 5.0 LE
PSA Level-2 certified
Ultra-low power
FreeRTOS/Zephyr supported
Block Diagram
Block diagram
Core Architecture
Real-M300 (KM4)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 345MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Integrated FPU/DSP extensions
Hardware-enforced isolation via TrustZone®-M
Real-M200 (KM0)
Armv8-M architecture (Arm® Cortex®-M23 ISA compatible)
Up to 115MHz, 2-stage pipeline
Code-compatible with KM4, Optimized for μA-level operation
Memory System
On-chip memory: 512KB SRAM
External memory (including KGD):
QSPI NOR Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 200MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripheral Interfaces
Flexible design of GPIO configuration
Multi-communication interfaces: SPI x 2, UART x 4, I2C x 2
Hardware Key-Scan interface supports up to 8*8 (64) keys
Hardware IR transceiver, easy to adapt to various IR protocols
Supports Real-Time Clock timer together with 10 basic timers
Supports 8 channels of PWM timer and 1 capture timer
Supports 7 channels of general 12-bit ADC and 1 channel of VBAT
Supports 4 channels of touch pad
Supports 8 independent channels of GDMA
Supports USB 2.0 full-speed device mode
Supports SDIO device with 1-bit and 4-bit mode
Embeds a serial LEDC to control the external LED lamps
Integrated Pixel Processing Engine (PPE) to process pixel data faster
Integrated OSPI display interface supports screens with OSPI/QSPI/SPI interfaces
Integrated audio codec supports 2 channels DMIC interface
I2S x 2: up to 384kHz sampling rate
Security Features
Secure boot
Arm TrustZone-M security architecture
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD password protection
2KB OTP memory (2K bits available for user)
PSA Level-2 certified
Wireless Connectivity
Wi-Fi 4 (802.11a/b/g/n)
802.11 a/b/g/n, 1T1R, 2.4GHz/5GHz dual-band
40MHz channel bandwidth, MCS0 ~ MCS7 modulation
Antenna diversity
WoWLAN power saving:
84μA@2.4GHz (DTIM=10, 3.3V, 25°C)
122μA@5GHz (DTIM=10, 3.3V, 25°C)
Bluetooth 5.0 LE
LE Coded PHY long-range mode (125kbps/500kbps)
Scatternet: 8 masters + 3 slaves
Tx Power: -10dBm ~ +10dBm (typical 8dBm)
Rx sensitivity: -99dBm@1Mbps
Power Management
Dynamic voltage/frequency scaling (1.71V ~ 3.63V)
Power modes:
Active mode: Full operation (345MHz)
Sleep mode: Peripherals or Wi-Fi can wake up the system (<100uA)
Deep-Sleep mode: 10.4µA (1.8V, 25°C)
Package and Reliability
QFN48 package: 6mm x 6mm
QFN68 package: 8mm x 8mm
BGA100 package: 5.1mm x 5.1mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Wide-range voltage: 1.71V ~ 3.63V
Operating temperature:
Standard temperature: -20°C ~ 85°C
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Smart home appliance
Line controller
Smart door lock
Battery camera
Smart remote controller
Wi-Fi speaker
WHC FullMAC NIC
BLE gateway
Smart POS
Integrates Wi-Fi, Low-Power Bluetooth (BLE 5.0/5.2/5.3), and Classic Bluetooth (BR/EDR), features rich peripheral interfaces, achieves system-level protection through a hardware-based security architecture, and delivers optimal power consumption performance. Support for Classic Bluetooth expands the diversity of end-product form factors.
Resources
Product Comparison
Package number |
Real-M300 |
KR4 |
DSP |
On-chip SRAM |
TrustZone |
Flash |
PSRAM |
Wi-Fi |
Bluetooth |
Operating temperature |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8726EAM-VA4-CG |
400MHz |
400MHz |
500MHz |
512KB |
Y |
X |
16MB |
Wi-Fi 6 (2.4GHz) |
Bluetooth 5.2 LE |
-20°C ~ 85°C |
QFN68 (8 x 8) |
Key Features
ARM/RISC-V/Cadence® Tensilica® HiFi 5 DSP three-core architecture
Wi-Fi 6 2.4GHz
Bluetooth 5.2 LE
Applicable for compute-intensive scenarios such as speech recognition
Block Diagram
Core Architecture
Real-M300 (KM4)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 400MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Integrated FPU/DSP extensions, and M-profile Vector Extension (MVE)
Hardware-enforced isolation via TrustZone®-M
KR4
RISC-V RV32IMAFC architecture
400MHz single-issue in-order pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Open-source ISA with custom extension support
Cadence® Tensilica® HiFi 5 DSP
500MHz 5-slot VLIW architecture
8 x 32-bit MAC/cycle, Optional SP-FPU (8 SP-FMAC/cycle)
Neural Network Extension (32 x 8-bit MAC/cycle)
32KB 4-way I-Cache, 48KB 3-way D-Cache
256KB dedicated DTCM memory
Memory System
On-chip memory: 512KB SRAM
External memory (including KGD):
QSPI NOR Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 250MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripheral Interfaces
Matrix-type pin configuration, each pin supports almost all functions
Multiple communication interfaces: SPI x 2, UART x 5, I2C x 2
Hardware IR transceiver, easy to adapt to various IR protocols
Supports RTC timer and 15 independent timers
Supports 8-channel PWM timer and 1 capture timer
Supports 6-channel general-purpose 12-bit ADC
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports 1 independent watchdog, 2 secure area watchdogs, and 3 general watchdogs
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Audio system:
3-channel ADC or 4-channel digital microphone (DMIC) input
1-channel digital-to-analog converter (DAC)
Integrates 2 I2S interfaces (up to 384kHz sampling rate, supports up to 8-channel data transmission and reception)
Security
Secure boot
Arm TrustZone-M security architecture
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD port password protection/disabling
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (2.4GHz 802.11ax)
Supports 802.11b/g/n/ax protocols with 20MHz bandwidth
PHY rates:286.8Mbps (HT40), 114.7Mbps (HE20)
Antenna diversity
Bluetooth 5.2 LE
LE Coded PHY long-range mode (125kbps/500kbps)
AoA/AoD positioning (±15° accuracy)
Scatternet concurrent master/slave operation
SIG Mesh v1.0 and v1.1.1
RF Performance
Wi-Fi Tx power:
11b 11Mbps: 20dBm
11g 54Mbps: 19dBm (EVM < −25dB)
11n MCS7-HT20: 18dBm (EVM < −27dB)
11ax MCS9-HE20: 16dBm (EVM < −32dB)
Wi-Fi Rx sensitivity:
11b 11Mbps: −91dBm
11g 54Mbps: −78dBm
11n MCS7-HT20: −76.5dBm
11ax MCS9-HE20: −70.5dBm
BLE specifications:
Tx power: +10dBm (0.5dB step)
Rx sensitivity: -97dBm@1Mbps
Power Management
Dynamic voltage scaling (0.8V ~ 1.2V)
Power modes:
Active mode (Wi-Fi Tx): 120mA@3.3V
Sleep mode: Peripherals and Wi-Fi can wake up the system
Deep-Sleep mode: 15μA (RTC retention)
Package and Reliability
QFN48 package: 6mm x 6mm
QFN68 package: 8mm x 8mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Standard temperature: -20°C ~ 85°C
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Home appliance
Line controller
BLE gateway
Micro inverter
Portable energy storage
Home energy storage
Resources
Product Comparison
Package number |
CA32 |
Real-M300 |
Real-M300 |
On-chip SRAM |
TrustZone |
NOR Flash |
PSRAM |
DDR |
Wi-Fi |
Bluetooth |
GPIO |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8730EAH-VA3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
8MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAH-VD3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
16MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAH-VH6-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
32MB |
X |
64MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAM-VA6-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
64MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730ELH-VA3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
8MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
RTL8730ELM-VA7-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
128MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
RTL8730ELM-VA8-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
256MB (DDR3L) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
Key Features
Wi-Fi 6 2.4GHz/5GHz dual-band
BT dual mode (BLE 5.3 + BT Classic)
Dedicated antenna for Bluetooth
Dual-Core Arm® Cortex®-A32 & Linux/FreeRTOS supported
DDR & PSRAM supported
Low power
Block Diagram
Core Architecture
Dual-Core Arm® Cortex®-A32 (AP)
Armv8-A architecture (ISA)
Up to 1.2GHz, 8-stage in-order pipeline
32KB 2-way I-Cache + 32KB 4-way D-Cache, 256KB 8-way L2 cache
TrustZone® security for secure/non-secure domain isolation
Real-M300 (KM4, NP)
Up to 333MHz, 3-stage pipeline
16KB 4-way I-Cache + 32KB 4-way D-Cache
Cortex®-M55 ISA, FPU/DSP/MVE extensions
TrustZone®-M hardware isolation
Real-M200 (LP)
Uo to 40MHz
16KB 2-way I-Cache + 8KB 2-way D-Cache
Cortex®-M23 ISA, optimized for power-critical applications
Memory System
On-chip memory: 512KB SRAM
qExternal memory (including KGD):
QSPI NOR/NAND Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 250MHz)
DQ16 DDR2/DDR3L (up to 533MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripherals & Interfaces
Flexible design of GPIO configuration
Multi-communication interfaces: SPI x 2, UART x 4, I2C x 3
Hardware IR transceiver, easy to adapt to various IR protocols
Supports 6 channels of general 12-bit ADC and 1 channel of VBAT
Audio Codec:
5-channel ADC or 8-channel digital microphone (DMIC) input
2-channel digital-to-analog converter (DAC) and headphone amplifier
Supports 6-channel PWM timer and 1 capture timer
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports high-speed USB 2.0 OTG
Supports SD host controller to access SD card and eMMC device
Supports 1 Real-Time Clock timer together with 12 basic timers
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Supports two-lane MIPI-DSI interface with D-PHY and the maximum bit rate of 1Gbps per lane
I2S x 2: up to 384kHz sampling rate
Security
Secure boot
TrustZone®/TrustZone®-M dual-domain isolation
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA/EdDSA/RSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD interface lock
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (802.11ax) :
802.11 a/b/g/n/ax, 1T1R, 2.4GHz/5GHz dual-band
MCS0-MCS9 (20 MHz bandwidth)
Antenna diversity, Beamforming, Target Wake Time (TWT)
WoWLAN
Bluetooth 5.3:
BR/EDR + BLE
LE Coded PHY long-range mode (125kbps/500kbps)
LE Audio (CIS/BIS)
AoA/AoD positioning
SIG Mesh v1.0/v1.1
Scatternet support
Dedicated antenna for Bluetooth
Power Management
Fine-grained clock gating, dynamic voltage/frequency scaling (DVFS)
Power modes: Active/Sleep/Deep-Sleep (μA-level standby)
Package and Reliability
QFN100 package: 10mm x 10mm
DR-QFN144 package: 11mm x 11mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Smart speakers
Industrial gateways
Voice-controlled appliances
Smart Home
Wearables
Centralized control systems
Integrates Wi-Fi and Low-Power Bluetooth (BLE 5.0/5.2/5.3), features rich peripheral interfaces, achieves system-level protection through a hardware-based security architecture, and delivers the lowest power consumption performance. Includes an LCD display module to accelerate GUI human-machine interaction development.
Resources
Product Comparison
Part number |
Real-M300 |
Real-M200 |
On-chip SRAM |
TrustZone |
Flash |
PSRAM |
Wi-Fi |
Bluetooth |
Operating voltage |
Operating temperature |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8721DAF-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8721DAF-VT2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-40°C ~ 105°C |
QFN48 (6 x 6) |
RTL8721DAM-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN48 (6 x 6) |
RTL8721DCF-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721DCM-VA2-CG |
345MHz |
115MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721DCM-VA3-CG |
345MHz |
115MHz |
512KB |
Y |
X |
8MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
2.97V ~ 3.63V |
-20°C ~ 85°C |
QFN68 (8 x 8) |
RTL8721DGF-VW2-CG |
345MHz |
115MHz |
512KB |
Y |
4MB |
X |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
1.71V ~ 3.63V |
-20°C ~ 85°C |
BGA100 (5.1 x 5.1) |
RTL8721DGM-VW2-CG |
345MHz |
115MHz |
512KB |
Y |
X |
4MB |
Wi-Fi 4 (2.4GHz + 5GHz) |
Bluetooth 5.0 LE |
1.71V ~ 3.63V |
-20°C ~ 85°C |
BGA100 (5.1 x 5.1) |
Key Features
Wi-Fi 4 2.4GHz/5GHz Dual-band + Bluetooth 5.0 LE
PSA Level-2 certified
Ultra-low power
FreeRTOS/Zephyr supported
Block Diagram
Block diagram
Core Architecture
Real-M300 (KM4)
Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)
Up to 345MHz, 3-stage pipeline
16KB 4-way I-Cache + 16KB 4-way D-Cache
Integrated FPU/DSP extensions
Hardware-enforced isolation via TrustZone®-M
Real-M200 (KM0)
Armv8-M architecture (Arm® Cortex®-M23 ISA compatible)
Up to 115MHz, 2-stage pipeline
Code-compatible with KM4, Optimized for μA-level operation
Memory System
On-chip memory: 512KB SRAM
External memory (including KGD):
QSPI NOR Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 200MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripheral Interfaces
Flexible design of GPIO configuration
Multi-communication interfaces: SPI x 2, UART x 4, I2C x 2
Hardware Key-Scan interface supports up to 8*8 (64) keys
Hardware IR transceiver, easy to adapt to various IR protocols
Supports Real-Time Clock timer together with 10 basic timers
Supports 8 channels of PWM timer and 1 capture timer
Supports 7 channels of general 12-bit ADC and 1 channel of VBAT
Supports 4 channels of touch pad
Supports 8 independent channels of GDMA
Supports USB 2.0 full-speed device mode
Supports SDIO device with 1-bit and 4-bit mode
Embeds a serial LEDC to control the external LED lamps
Integrated Pixel Processing Engine (PPE) to process pixel data faster
Integrated OSPI display interface supports screens with OSPI/QSPI/SPI interfaces
Integrated audio codec supports 2 channels DMIC interface
I2S x 2: up to 384kHz sampling rate
Security Features
Secure boot
Arm TrustZone-M security architecture
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD password protection
2KB OTP memory (2K bits available for user)
PSA Level-2 certified
Wireless Connectivity
Wi-Fi 4 (802.11a/b/g/n)
802.11 a/b/g/n, 1T1R, 2.4GHz/5GHz dual-band
40MHz channel bandwidth, MCS0 ~ MCS7 modulation
Antenna diversity
WoWLAN power saving:
84μA@2.4GHz (DTIM=10, 3.3V, 25°C)
122μA@5GHz (DTIM=10, 3.3V, 25°C)
Bluetooth 5.0 LE
LE Coded PHY long-range mode (125kbps/500kbps)
Scatternet: 8 masters + 3 slaves
Tx Power: -10dBm ~ +10dBm (typical 8dBm)
Rx sensitivity: -99dBm@1Mbps
Power Management
Dynamic voltage/frequency scaling (1.71V ~ 3.63V)
Power modes:
Active mode: Full operation (345MHz)
Sleep mode: Peripherals or Wi-Fi can wake up the system (<100uA)
Deep-Sleep mode: 10.4µA (1.8V, 25°C)
Package and Reliability
QFN48 package: 6mm x 6mm
QFN68 package: 8mm x 8mm
BGA100 package: 5.1mm x 5.1mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Wide-range voltage: 1.71V ~ 3.63V
Operating temperature:
Standard temperature: -20°C ~ 85°C
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Smart home appliance
Line controller
Smart door lock
Battery camera
Smart remote controller
Wi-Fi speaker
WHC FullMAC NIC
BLE gateway
Smart POS
Resources
Product Comparison
Package number |
CA32 |
Real-M300 |
Real-M300 |
On-chip SRAM |
TrustZone |
NOR Flash |
PSRAM |
DDR |
Wi-Fi |
Bluetooth |
GPIO |
Package (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
RTL8730EAH-VA3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
8MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAH-VD3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
16MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAH-VH6-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
32MB |
X |
64MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730EAM-VA6-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
64MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
40 |
QFN100 (10 x 10) |
RTL8730ELH-VA3-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
8MB |
8MB |
X |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
RTL8730ELM-VA7-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
128MB (DDR2) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
RTL8730ELM-VA8-CG |
1.2GHz |
333MHz |
40MHz |
256KB |
Y |
X |
X |
256MB (DDR3L) |
Wi-Fi 6 (2.4GHz + 5GHz) |
Bluetooth 5.3 |
61 |
DR-QFN144 (11 x 11) |
Key Features
Wi-Fi 6 2.4GHz/5GHz dual-band
BT dual mode (BLE 5.3 + BT Classic)
Dedicated antenna for Bluetooth
Dual-Core Arm® Cortex®-A32 & Linux/FreeRTOS supported
DDR & PSRAM supported
Low power
Block Diagram
Core Architecture
Dual-Core Arm® Cortex®-A32 (AP)
Armv8-A architecture (ISA)
Up to 1.2GHz, 8-stage in-order pipeline
32KB 2-way I-Cache + 32KB 4-way D-Cache, 256KB 8-way L2 cache
TrustZone® security for secure/non-secure domain isolation
Real-M300 (KM4, NP)
Up to 333MHz, 3-stage pipeline
16KB 4-way I-Cache + 32KB 4-way D-Cache
Cortex®-M55 ISA, FPU/DSP/MVE extensions
TrustZone®-M hardware isolation
Real-M200 (LP)
Uo to 40MHz
16KB 2-way I-Cache + 8KB 2-way D-Cache
Cortex®-M23 ISA, optimized for power-critical applications
Memory System
On-chip memory: 512KB SRAM
qExternal memory (including KGD):
QSPI NOR/NAND Flash (up to 104MHz)
DQ8 DDR mode PSRAM (up to 250MHz)
DQ16 DDR2/DDR3L (up to 533MHz)
Bus architecture: Multi-layer AXI bus with parallel access
Peripherals & Interfaces
Flexible design of GPIO configuration
Multi-communication interfaces: SPI x 2, UART x 4, I2C x 3
Hardware IR transceiver, easy to adapt to various IR protocols
Supports 6 channels of general 12-bit ADC and 1 channel of VBAT
Audio Codec:
5-channel ADC or 8-channel digital microphone (DMIC) input
2-channel digital-to-analog converter (DAC) and headphone amplifier
Supports 6-channel PWM timer and 1 capture timer
Supports 9-channel touch key
Supports 8 independent channel GDMA
Supports high-speed USB 2.0 OTG
Supports SD host controller to access SD card and eMMC device
Supports 1 Real-Time Clock timer together with 12 basic timers
Embeds a serial LEDC to control the external LED lamps
Supports thermal detector to detect and monitor the real-time temperature inside the chip
Supports two-lane MIPI-DSI interface with D-PHY and the maximum bit rate of 1Gbps per lane
I2S x 2: up to 384kHz sampling rate
Security
Secure boot
TrustZone®/TrustZone®-M dual-domain isolation
True Random Number Generator (TRNG)
Hardware encryption engine (AES/SHA/ECDSA/EdDSA/RSA)
Flash full-disk/partition encryption
Read Protection (RDP) mechanism
JTAG/SWD interface lock
2KB OTP memory (2K bits available for user)
Wireless Connectivity
Wi-Fi 6 (802.11ax) :
802.11 a/b/g/n/ax, 1T1R, 2.4GHz/5GHz dual-band
MCS0-MCS9 (20 MHz bandwidth)
Antenna diversity, Beamforming, Target Wake Time (TWT)
WoWLAN
Bluetooth 5.3:
BR/EDR + BLE
LE Coded PHY long-range mode (125kbps/500kbps)
LE Audio (CIS/BIS)
AoA/AoD positioning
SIG Mesh v1.0/v1.1
Scatternet support
Dedicated antenna for Bluetooth
Power Management
Fine-grained clock gating, dynamic voltage/frequency scaling (DVFS)
Power modes: Active/Sleep/Deep-Sleep (μA-level standby)
Package and Reliability
QFN100 package: 10mm x 10mm
DR-QFN144 package: 11mm x 11mm
Operating voltage:
Standard voltage: 2.97V ~ 3.63V
Operating temperature:
Wide-range temperature: -40°C ~ 105°C
ESD protection: HBM ±3.5kV
Application Scenarios
Smart speakers
Industrial gateways
Voice-controlled appliances
Smart Home
Wearables
Centralized control systems
